Chip multilayer ceramic capacitor, something many people don't know   Chip multilayer ceramic dielectric capacitor (MLCC) - referred to as chip capacitor for short, is composed of ceramic dielectric films printed with electrodes (inner electrodes) stacked in a staggered manner, and then a ceramic chip is formed by one-time high-temperature sintering, and then metal layers (outer electrodes) are sealed on both ends of the chip to form a structure similar to monolith, so it is also called monolith capacitor.   The structure of multilayer chip ceramic capacitor mainly includes three parts: ceramic dielectric, metal inner electrode and metal outer electrode. The multilayer chip ceramic capacitor is a multilayer stacked structure. In short, it is a combination of several simple parallel plate capacitors.   Regarding 5g base stations, some people in the industry say that the MLCC usage of 5g base stations is more than three times higher than that of 4G base stations.   As for automotive electronics & electric vehicles, in addition, with the development of automotive electronics and electric vehicles, the demand for chip multilayer ceramic capacitors (MLCC) is also increasing. Take Tesla as an example, the consumption of chip multilayer ceramic capacitors (MLCC) for each new energy vehicle is more than 8000, while the consumption of chip multilayer ceramic capacitors (MLCC) for traditional vehicles is only about 2400. Other vehicle grade chip multilayer ceramic capacitors MLCC have also become the market where large manufacturers compete to layout. For example, the average demand for MLCC for each vehicle of advanced driving assistance system (ADAS) is 2000 to 3000, the demand for MLCC for each vehicle of safety system is 300 to 1000, and the demand for chip multilayer ceramic capacitors MLCC for non safety system is 500 to 2500.   Ceramic capacitors are divided into single-layer ceramic capacitors and multi (stacked) layer ceramic capacitors (MLCC). The capacitance content is directly proportional to the product surface area and the number of ceramic film stacking layers. Due to the progress of ceramic film stacking technology, the capacitance content is also higher (Japanese enterprises have been implementing a 2 μ M U.M PET film medium and the thickness of the single layer medium is 1 μ M, the capacitance value is 100 μ F's MLCC) may replace the market application of medium and low capacitors such as electrolytic capacitors and tantalum capacitors in the future. Moreover, MLCC can be directly adhered through SMT, and the production speed is faster than electrolytic capacitors and tantalum capacitors. In addition, 3C electronic products tend to be light, thin and short, and MLCC's advantages of easy to chip and small size will be more prominent.   At present, the demand for chip capacitors in the world is more than 200 billion, 70% of which comes from Japan (such as Murata, a major MLCC manufacturer), followed by Europe, America and Southeast Asia (including China).

片式多层陶瓷电容器，很多人不知道的事   片式多层瓷介电容器(mlcc)---简称片式电容器,是由印好电极（内电极）的陶瓷介质膜片以错位的方式叠合起来，经过一次性高温烧结形成陶瓷芯片，再在芯片的两端封上金属层（外电极），从而形成一个类似独石的结构体，故也叫独石电容器。   多层片式陶瓷电容器的结构主要包括三大部分：陶瓷介质，金属内电极，金属外电极。而多层片式陶瓷电容器它是一个多层叠合的结构，简单地说它是由多个简单平行板电容器的并联体。   关于5G基站在5G基站方面，也有业内人士称5G基站MLCC用量较4G基站提升超过3倍。   关于汽车电子化&电动车另外，随汽车电子化、电动车也在推升车规片式多层瓷介电容器MLCC的需求，以特斯拉为例，每台新能源车片式多层瓷介电容器MLCC用量超过8000颗，传统汽车的片式多层瓷介电容器MLCC用量仅为约2400颗。其他车规级片式多层瓷介电容器MLCC也成为大厂争相布局的市场，例如先进驾驶辅助系统（ADAS）平均每台车对MLCC的需求量在2000颗到3000颗，安全系统每台车对MLCC需求量在300颗到1000颗，非安全系统对片式多层瓷介电容器MLCC的需求量在500颗到2500颗。   陶瓷电容分成单层陶瓷电容与多（积）层陶瓷电容(MLCC)，其电容值含量与产品表面积大小、陶瓷薄膜堆叠层数成正比，由于陶瓷薄膜堆叠技术的进步，电容值含量也越高（日本企业已在实现在2μm的PET薄膜介质上叠1000层工艺实践，生产出单层介质厚度为1μm电容值为100μF的MLCC）未来可能会取代中低电容如电解电容和钽质电容的市场应用，且MLCC可以透过SMT直接黏着，生产速度比电解电容和钽质电容更快，加上3C电子商品走向轻薄短小特性，MLCC易于晶片化、体积小的优势将更加突出。   目前，世界片式电容的需求量在2000亿支以上，70%出自日本（如MLCC大厂村田muRata），其次是欧美和东南亚（含中国）。

How Polymer Aluminum Capacitor can be used to maximize its effect Polymer aluminium capacitors are laminated aluminium electrolytic capacitors with high conductivity polymer materials as cathodes. They have superior electrical performance beyond existing liquid chip aluminium electrolytic capacitors and solid chip tantalum electrolytic capacitors. Polymer aluminium capacitors are within the rated voltage range and do not need to be used for voltage reduction. When designing power transfer solutions for USB power supply and electronic systems and subsystems, including IC, specific application IC (ASIC), central processor (CPU), and field programmable gate array (field programmable gate array) (field programmable gate array), designers will continuously look for ways to improve efficiency while ensuring stable, noise-free power over a wide temperature range in a compact size. They need to improve efficiency, stability and reliability, reduce costs, and reduce the size of the solution. At the same time, the increasing power performance requirements in applications must be met, including smoothing the input and output currents of power circuits, supporting peak power requirements, and suppressing voltage fluctuations. To meet these challenges, designers need capacitors with low equivalent series resistance (ESR) and high frequency and low impedance to support ripple absorption and ensure smooth, fast transient response. Operational and supply chain reliability are also important. Throughout these issues and options, polymer aluminium electrolytic capacitors are a good solution with high electrical performance and stability, low noise, good reliability, compact size, and low supply chain risk due to the non-use of conflicting materials. They have low ESR (usually measured in milliohms (m_) and high frequency (up to 500 kHz) low impedance, and provide excellent noise suppression, ripple absorption, and power line decoupling performance. In addition, it has capacitive stability at high operating frequency and temperature. The performance characteristics of polymer aluminium electrolytic capacitors make them ideal for power management applications, including power supplies for CPUs, ASIC, GA, and other large ICs, and support peak power requirements for USB power systems.

聚合物铝电容器什么样的使用方式能发挥最大的效果 聚合物铝电容器是采用高电导率的聚合物材料作为阴极的片式叠层铝电解电容器，具有超越现有液体片式铝电解电容器和固体片式钽电解电容器的卓越电性能。聚合物铝电容器在额定电压范围内，无需降压使用。 在设计 USB 电源以及电子系统和子系统（包括 IC、特定应用 IC (ASIC)、中央处理器 (CPU) 和现场可编程门阵列 (FPGA)）的功率输送解决方案时，设计人员会不断寻找方法来提高效率，同时确保以紧凑的外形尺寸在宽温度范围内提供稳定、无噪声的功率。 他们需要提高效率、稳定性和可靠性，降低成本，并缩小解决方案的外形尺寸。同时，还必须满足应用中不断增多的功率性能要求，包括平滑处理电源电路的输入和输出电流、支持峰值功率需求以及抑制电压波动。 为了应对这些挑战，设计人员需要具有低等效串联电阻 (ESR) 和高频低阻抗的电容器，以支持纹波吸收并确保平滑的快速瞬态响应。此外，运营可靠性和供应链可靠性也很重要。 纵观这些问题和选项，聚合物铝电解电容器是一个很好的解决方案，具有较高电气性能和稳定性，噪声低、可靠性佳、外形尺寸紧凑，并且由于不使用冲突材料，供应链风险低。它们具备低 ESR（通常以毫欧 (mΩ) 为单位测量）和高频（高达 500 千赫兹 (kHz)）低阻抗，并且提供出色的噪声抑制、纹波吸收和电源线去耦性能。此外，在高工作频率和温度下也具有电容稳定性。 聚合物铝电解电容器的性能特点使其非常适用于电源管理应用，包括 CPU、ASIC、FPGA 和其他大型 IC 的电源，并支持 USB 电源系统的峰值功率需求。

电压监控器，或者叫电压检测仪是电源管理集成电路ic的产品之一，电压监测仪是对电力系统正常运行状态缓慢变化所引起的电压偏差进行连续的监测和统计的统计型电压监测仪。具备监测、分析、记忆、查询、参数设置等功能。 防静电监控器采用高精密度电子元器件制作而成，具有精度高、反应速度快、抗干扰能力强、体积小、重量轻、使用简单等特点；对于人体手腕带接地系统有自动报警功能，可随时监视防静电手腕带的工作状态，运行无噪音，能为防静电（个人）工作区域的手腕带接地系统提供可靠的保障。 在我们的电子工业中，静电始终是一个巨大的危害，因为当我们日常活动摩擦带电或对人体工作带电时，它将对电子产品造成极大的伤害。 正是由于这些因素，我们必须制定足够的防静电措施，因此我们今天谈论的这种防静电监控器设备出现了，安装它的原因是什么？ 在这里我先需要明确的是，静电的积累是不可避免。当严重的静电放电时，甚至可能灼伤人体皮肤。 过量时，它会破坏人体的内分泌系统，并对我们的身体造成无法弥补的损害。因此，为了实时监控静电的积累，我们安装了防静电监控器，不仅可以保护员工的健康，而且对员工的健康表现出负责任的态度。 在一些电子工厂中，员工的主要工作是生产电子零件。 这样的精密电子部件容易被静电击穿，损坏的电子部件迅速老化，这降低了电子部件的质量，甚至降低了产品的产量。 因此，为了获得更大的利益并提高产量，有必要安装一个监控系统。 静电很容易引起电磁干扰，并且电子设备容易出现故障或误操作。 如果车间内有易燃易爆产品或油雾，很容易在静电作用下引起巨大的爆炸和火灾。 因此，必须安装防静电监视器。 毕竟，没有人想要看到他的工厂发生爆炸或火灾。 可以进行实时连续监控，并对整个接地系统进行实时监控； 它可以确保在防静电工作区域（个人，双人或多人）正常使用接地系统。 使用这种全时实时监控器已经改变了传统的静电接地方法。 可以根据现场任意组合，一个电源可以与20个静电工作站组合。