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The main characteristics and working principles of thermal resistance

What is thermal resistance?Thermal resistance is a category of sensitive components. The resistance value of thermal resistance will change with the temperature. Unlike the general fixed resistance, it is a category of variable resistors and is widely used in various electronic components. Different from pure metals in the resistance thermometer, the materials used in thermal resistors are usually ceramics or polymers. The higher the temperature coefficient thermistor, the greater the resistance value when the temperature, the lower the thermistor of the negative temperature coefficient when the temperature is, the lower the resistance value, and they belong to the semiconductor device. The thermal resistance is usually a higher accuracy within a limited temperature range, usually -90 ° C? 130 ℃. The main characteristics of thermal resistance1. High sensitivity, its resistance temperature coefficient is more than 10 to 100 times larger than the metal, which can detect temperature changes at 10-6 ° C;2. The working temperature range is wide, the normal temperature devices are applicable to -55 ℃ ～ 315 ℃, the applicable temperature of high temperature devices is higher than 315 ℃ (currently can reach 2000 ° C), and low temperature devices are suitable for -273 ° C to -55 ° C;3. Small volume, can measure the temperature of the gaps, cavity and biological blood vessels that other thermometers cannot measure;4. Easy to use, the resistance value can be selected arbitrarily between 0.1 ～ 100kΩ;5. Easy processing into complex shapes can be produced in large quantities;6. Good stability and strong overload capacity. The principle of thermal resistance working principleThermal resistance is a sensor resistor, the resistance value of thermistor, which changes with the changes in temperature, which is different from the general fixed resistance. The resistance value of the metal increases with the increase of the planting, but the semiconductor is the opposite. Its resistance value has decreased sharply with the increase of temperature, and it presents non -linear. When the temperature changes are the same, the resistance value of the thermistor resistance is about 10 times the lead thermal resistance. Therefore, it can be said that thermistor is particularly sensitive to changes in temperature. This temperature characteristics of semiconductor. It is because the conductive method of semiconductor is carrier (electronics, cave) conductive. Because the number of carriers in semiconductors is much less than free electrons in metals, its resistance is very large. As the temperature rises, the number of carrier flows participating in semiconductors will increase, so the semiconductor conductivity increases, and its resistivity will decrease. Thermistor is a thermist component made of the characteristics of the semiconductor resistance with the temperature of the semiconductor. It is made of different metal oxides according to different formulas. Within a certain temperature range, according to the changes in thermal resistance value, the temperature changes of the measured medium can be known. When installing the thermistor in the circuit, when the thermistor is the same as the ambient temperature, the action time is sharply shortened as the current increases; when the thermistor has a shorter action time and smaller when the ambient temperature is relatively high at the relatively high ambient temperature Maintain current and action current. When the circuit is working normally, the thermistor temperature is similar to the room temperature and the resistance is small, and the connecting the circuit will not hinder the passing of the current; when the circuit occurs due to the failure, the thermistor is increased due to the increase in thermal power. When the temperature exceeds the switch temperature, the resistance will increase in an instant, and the current in the circuit will quickly decrease to the safe value.For more electronic conponents,please refer to:https://www.ciselec.com/en/products.html

Classification and application of sensors

There are many classification methods of sensors. There are usually 4 methods:1. Divided into: displacement sensor, pressure sensor, speed sensor temperature sensor and gas sensitive sensor according to the input physical quantity. 2. Based on the working principle: resistance, inductance, capacitance, and potential. 3. Based on the nature of the output signal: analog sensor and digital sensor. 4. Based on the principle of energy conversion, it is divided into: active sensors and passive sensors. The source sensor converts non -electrical energy to electrical energy, such as electric momentum, charge -type sensors, etc.; The passive sensor does not afford the energy conversion effect, but the amount of non -electrical volume is rotated to the number of electrical parameters, such as resistance, inductive sensors The types of commonly used sensorsUsually, according to its basic perception function, it can be divided into ten major ten major majority of thermist components, optical components, osteitted components, Lijin components, magnetic sensitivity elements, wet sensitivity components, sound sensitivity elements, radiation sensitive components, color sensitivity components, and Weimin components. kind. 1. Heat sensorThe thermist sensor is a conversion device that converts temperature into a telecommunications signal, which can be divided into two categories: active and passive. The former's working principle is thermal release effect, thermal power effect, and semiconductor knotting effect. The working principle of the latter is the thermal characteristics of the resistance, accounting for about 55%of the thermist sensor. This sensor is more applicable in the occasion where the temperature detection accuracy is relatively high. The broader thermal resistance materials are platinum, copper, nickel, etc. They have the characteristics of large resistance temperature coefficients, good linearity, stable performance, wide use temperature range, and easy processing. It is used to measure temperature within the range of -200 ℃ ～+500 ℃. 2. Optical sensorThe light sensor is one of the most common sensors. There are many types, mainly: optical pipes, photoelectric multiplication pipes, photoresist resistance, solar cells, solar batteries, infrared sensors, ultraviolet sensors, fiber optoelectronics sensors, color sensors, CCDs and CCD and CMOS image sensor, etc. Major domestic manufacturers include the OTRON brand. The light sensor is one of the most output and the most widely used sensor. It occupies a very important position in automatic control and non -electrical electricity testing technology. The easiest light sensor is the light resistance, and the current will generate current when the photon shock junction is generated. 3. Qi -sensitive sensorQi -sensitive sensor is a sensor used to detect gas concentration and ingredients, which plays a very important role in environmental protection and safety supervision. The gas -sensitive sensor is exposed to the gas of various ingredients. Because the temperature and humidity of the detection site have changed a lot, there are a lot of dust and oil mist, so their working conditions are harsh, and the material of the gas to the sensing element is material. Chemical reactions are generated, attached to the surface of the component, often making their performance worse. Therefore, there is the following requirements for the gas -sensitive sensor: it can detect the allowable concentration of the alarm gas and the gas concentration of other standard values. It can work stable for a long time, good repetitiveness, fast response speed, and small effects caused by coexisting substances. 4. Limin sensorLimin sensor is a conversion device that converts mechanics such as stress and pressure into a electrical signal. The Limin sensor has various forms such as resistance, capacitance, inductance, voltage and current, and they each have advantages and disadvantages. It is widely used in various industrial self -control environments, involving water conservancy and hydropower, railway transportation, smart buildings, production self -control, aerospace, military, petrochemical, oil wells, electric power, ships, machine tools, pipelines and other industries. 5. Magnetic sensorHall sensors are a magnetic field sensor based on Hall effect, which is widely used in industrial automation technology, detection technology and information processing. Hall effect is the basic method of studying the performance of semiconductor materials. The Hall coefficient measured by Hall effect experiment can judge important parameters such as conductive type, load concentration, and load migration rate of semiconductor materials. The Hall effect sensor is a passive sensor. It must have external power supply to work. This feature allows it to detect the operation of low speed. 6. Wet sensitivity sensorThe wet sensor sensor can feel the external humidity changes and change the humidity into a device with the physical or chemical properties of the device material into a device with a useful signal. The characteristic requirements of the ideal wet sensitivity sensor are suitable for use within the wide temperature and wet range, and the measurement accuracy should be high; long service life and good stability; fast response speed, small wet stagnation difference, good reproducibility; sensitivity High, good linear, small temperature coefficients; simple manufacturing process, easy to produce in batches, simple conversion circuits, low cost; corrosion resistance, low temperature and high temperature characteristics, etc. 7. Sound sensorSound sensor is a sensor used for flow detection. The sensor can be set with power when wiring, and operates in a range mode of high/low sensitivity. The high -sensitivity volume is suitable for high -frequency signals that fluctuate at 40dB. The low -sensitivity range is applied to high -frequency signals from 28DB to 68DB. The sensor can operate alone by providing external power supply to control the device. Sound sensor is mainly used for solid flow detection. At the same time, the device can also be used for the detection of water pump air erosion and liquid leakage, and then generates sufficient sound alarm. 8. Radiation sensorAfter the material is radiated, it is irradiated. Some characteristics (such as refractive index) change. Collective referred to as radiation effects. For example, after some special ingredients (fiber -doped fiber) made of special ingredients, the refractive index changes. The receiving light intensity changes, so it can be made into a fiber radiation sensor. The role of radiation and material is the basis of all nuclear radiation sensors. 9. Visual sensorThe visual sensor has a pixel that captures the light from a whole image. The clearness and delicateness of the image are usually measured by resolution, which is represented by the number of pixels. The low cost and ease of visual sensor have attracted machine designers and craft engineers to integrate them into various types of applications that have relying on artificial, multiple photoelectric sensors, or unbridled applications at all. The industrial applications of visual sensors include inspection, measurement, measurement, directional, defect detection and separation. 10. Weimin sensor (electronic tongue)The electronic tongue is an analog tongue to analyze, identify and judge the sample measurement of samples, and use multiple statistical methods to process the obtained data, quickly reflect the overall quality information of the sample, and realize the identification and classification of samples. It is a detection technology based on the overall characteristics of the sample as the overall characteristic response signal that uses the multi -sensing arrays as the foundation to perceive the overall characteristics of the sample. It is mainly composed of three parts: the taste sensor array, the signal acquisition system and the mode recognition system.For more electronic conponents,please refer to:https://www.ciselec.com/en/products.html

Film 3D integrated circuit key technology

Ten key steps for manufacturing semiconductor chips

1. Design and mask productionThis process starts with chip design. The engineer creates a detailed layout design to specify the placement and interconnection of transistors, resistors and other components. The engineer will use the design to create a mold cover as a template that defines the pattern on the semiconductor wafer during the manufacturing process. 2. Worse preparationThe engineer uses silicon wafers as a substrate to undertake the task of polishing and cleaning to eliminate any impurities. Next, a thin layer of oxidation layer will be formed on the surface of the silicon wafer. It provides a smooth and uniform starting point for subsequent process steps. By controlling the formation of the oxidation layer, it can ensure the physical and chemical characteristics of the need, and provide a good foundation for subsequent deposition and pattern transfer. 3. Light carvingsDuring the light engraving, engineers will use the previously created mask to complete the key image transfer steps. First of all, they apply a layer of light glue on the wafer surface and place the mask on the lithography glue. Subsequently, through a specific light source and lens system, the pattern on the mask was exposed on the optical glue on the wafer surface. This exposure process makes the pattern on the mask be accurately transferred to the light glue. Next, selectively remove the exposure or unre exposed area through the development steps. After the development, the pattern on the lithography glue is retained on the wafer surface, providing accurate guidance for subsequent etching and material removal steps. 4. CaptiveThe etching is used to remove the material from the wafer that has been selectively removed. In order to create the required patterns, engineers use a variety of different etching processes to handle different materials, such as silicon, polysilicon and metal layer. By accurately controlled the etching process, the material can be ensured accurately, thereby forming accurate patterns and structures. 5. depositsChemical gas deposition (CVD) or physical gas sedimentation (PVD) and other technologies have deposited thin films (such as metal or insulating layers) on the surface of the wafer surface. These sedimentary layers form the conductivity, insulation layer and other components of semiconductor devices. 6. ion injectionThis step involves a specific area where the doping agent is introduced into the wafer to change its electrical performance. Ion injection is incident with a certain energy -scale ion beam. A series of physical and chemical interactions occur with the atoms or molecules in the material, which changes the surface component, structure and performance of the material, so as to optimize the surface performance of the material, or obtain a certain certain Some new excellent performance. Ion injection is essential to generate the required transistor characteristics. 7. EnemiesAfter the injection phase of the ion is injected, the wafer will be treated with high temperature annealing. The main purpose of this step is to activate any structural damage caused by doping agents and repair the injection process. Through annealing treatment, the defects caused by ionic injection were repaired, and the integrity of the wafer was restored, laying the foundation for subsequent manufacturing steps. 8. Chemical mechanical polishing (CMP)CMP is responsible for ensuring the smoothness and uniformity of the wafer surface. The main task of this step is to eliminate any protruding or depression on the surface and create a smooth and uniform surface. A smooth and uniform surface can reduce defects, improve electrical performance, and enhance long -term stability reliability of semiconductor devices. 9. Measurement testDuring the semiconductor manufacturing process, engineers will conduct a series of measurements and inspections to ensure that each step meets the required specifications and standards. This involves the use of highly accurate and complex tools to check the size, layer thickness, material purity, and other key parameters. The accuracy of measurement and inspection is essential for creating high -performance and reliability semiconductor devices. 10. PackingFinally, come to the packaging and testing session, and prepare for distribution and use. Packaging is a key step to protect the chip from environmental impact, and at the same time, it is necessary to ensure that its electrical and thermal performance meets the design requirements. With the continuous progress of technology, the packaging process is also developing to meet the needs of smaller and high -performance semiconductor devices.For more electronic conponents,please refer to:https://www.ciselec.com/en/products.html 

What is FPGA?

FPGA represents the on -site programming door array. In essence, FPGA is a set of interconnected digital sub -circuits that can achieve common functions and also provide very high flexibility. But it is necessary to fully understand FPGA. More subtle differences. This article introduces the concept behind FPGA, and briefly discusses what logical door is, how to program FPGA, and the difference between FPGA and microprocessors in design. FPGA and microcontroller (or, microcontroller can be used, why use FPGA?)Micro controller has become a leading component in modern electronic design. They are cheap and widely used. Now they are often used as a person's first introduction to the electronic world. We naturally continue to use the components we are familiar with, and as the microcontroller becomes stronger and stronger, there is no need to consider alternative solutions to cope with our design challenges. Nevertheless, the microcontroller is built around the processor. There are some basic restrictions in the processor. You need to recognize these restrictions. In some cases, these restrictions need to be overcome. So, when will engineers choose FPGA instead of microcontroller? The answer is attributed to software to hardware. The processor performs the task by performing instructions in order. This means that the operation of the processor is inherently limited: the desired function must adapt to the available instructions, and in most cases, it is impossible to complete multiple processing tasks at the same time. The microcontroller is constructed around a processor, the processor is constructed around a CPU, and a CPU performs one operation at one time. The instruction set is designed to be highly general, and the instructions can now be executed at a high frequency; however, these characteristics do not eliminate the shortcomings of software -based digital design methods. Another choice is a method of hardware. If each new design can be constructed around a digital IC that realizes the function required by the system, it will be very convenient: there is no need to write software, no instruction set restrictions, no delay, only one input pin, output output, output, output The IC of the digital circuit corresponding to the accurate operation of the pin and the necessary operation. This method is unrealistic because it needs to design an ASIC (special integrated circuit) for each circuit board. However, we can use this method to use FPGAS. What is the on -site programming door array?A good name can provide a lot of information. I think the "on -site programming door array" is a very good name. FPGA is a logical door array (eh, it is considered to see below), this array can be the program program (in fact, "configuration may be a better word) People come to complete. Let's take a closer look at these basic characteristics. Logic doors (with, or, different, etc.) are the basic components of digital circuits. Therefore, a digital device designed to achieve high configuration (that is, "on -site programming") consists of many custom -made ways. It is not surprising. However, FPGA is not a huge collection of a single Boors. This will be a very good way to provide configurable logic functions, because it does not use such a fact, that is, public operations can be achieved as a fixed module more effectively. The same principle is also obvious in the field of separate digital ICs. You can buy ICs composed of door, or door, but you don't want to use a single door to build a displacement register. Instead, you will buy a shift register integrated circuit. Therefore, FPGA is not just a door array. This is a series of carefully designed and interconnected digital sub -circuits that can achieve common functions efficiently while providing extremely high flexibility. Digital subcourse is called configurable logic module (CLB), which constitutes the core of FPGA programming logic function: CLB needs to interact with each other and interact with external circuits. For these purposes, FPGA uses a programmable interconnection matrix and input/output (I/O) module. FPGA's "program" is stored in the SRAM unit, affecting the function of CLB, and controlling the establishment of a connection path. Detailed explanation of the internal structure and operation of CLB requires a whole article (if it is not multiple articles). The general idea is that the CLB includes a multi -way reusrator that searches tables, storage elements (triggers or registers), and allows CLB to perform Boolean operations, data storage and arithmetic operations. The I/O module consists of various components to facilitate communication between CLB and other components on the board. These devices include pull/drop -down resistor, buffer and anti -phase device. On -site programming logic (or in other words, how to program FPGA?)How do we turn a CLB array into a digital circuit and make it accurately complete the function we want? At first glance, this seems to be a quite complicated task. In fact, FPGA is often considered more difficult than micro -controller programming. However, FPGA development does not need to completely understand the CLB function or internal interconnect, just as the micro -controller development does not require a thorough understanding of the processor's assembly language instructions or internal control signals. In fact, FPGA is misleading as an independent component. FPGAS is always supported by development software, and the software executes the complex process of transforming hardware design into a programming position that determines the programming position of interconnection and CLB behavior. Hardware description languagePeople have created language so that we can "describe" hardware; they are called (very appropriate) hardware description language (HDLS), the two most common are VHDL and Verilog. Although there are obvious similarities between HDL code and the code written in advanced software programming language, the two are fundamentally different. The software code specifies a series of operations, and the HDL code is more like a schematic diagram. Using text to introduce components and create interconnection. in conclusionThe basic characteristics of programming logic devices and the potential advantages of the system of the processor -based system. Hyundai FPGA is a complex high -performance device. It may be a bit daunting for those who are accustomed to collecting data, control ASIC and performing mathematical operations. However, it may be found that in certain applications, the improved performance and multifunctionality are worthy of design work.resolution, stability and anti -interference ability of the identification system. At this point, the virtual Digital Technology proposes the high -precision application of deep learning algorithms in the visual of the machine. In this context, the DLIA industrial defect detection plays a decisive role.The DLIA industrial defect detection By constructing a deep neural network model, the system can automatically learn and extract features from massive training samples, thereby achieving precise identification of complex and fine characters on the chip surface. Even in the face of image quality fluctuations caused by light change, angle deviation, or surface reflection, deep learning algorithms can be quickly adapted and made accurate judgments.With the deep fusion of machine vision and deep learning, the degree of automation and accuracy of chip surface character recognition has been greatly improved, significantly improved production efficiency, reducing human error risk, and providing details for subsequent product quality management and process optimization of process optimization. Reliable data support.This deep learning -enabled machine visual technology breaks through the limitations of traditional character recognition in accuracy and speed. Even the most subtle scratches, pollution or deformation can be discovered and recorded in time, which greatly improves the level of surface quality control level It effectively reduces the rate and repairs in the production process.The surface character recognition of the chip, as an important application scenario of machine vision technology in the microelectronics manufacturing industry. With its excellent performance of fusion and deep learning, it has become one of the key driving drivers for the high -quality development of the industry. New era of industrial quality inspection.For more electronic conponents,please refer to:https://www.ciselec.com/en/products.html